Samsung ikukonzekera kuchulukitsa katatu kuchuluka kwake kwa chip pofika 2027

Jeong Ki-tae, wachiwiri kwa purezidenti wa chitukuko chaukadaulo pakampani yoyambira bizinesi, adati Samsung Electronics idapanga bwino chip cha 3-nanometer kutengera ukadaulo wa GAA kwa nthawi yoyamba padziko lapansi chaka chino, ndikugwiritsa ntchito mphamvu zochepa ndi 45 peresenti, 23 peresenti yogwira ntchito kwambiri ndi 16 peresenti yochepa poyerekeza ndi chipangizo cha 5-nanometer.

Samsung Electronics ikukonzekeranso kuchita khama kuti ikulitse mphamvu yopangira chip foundry yake, yomwe ikufuna kuchulukitsa katatu mphamvu zake zopanga pofika chaka cha 2027. Kuti izi zitheke, wopanga makinawa akutsata njira ya "chipolopolo-choyamba", yomwe ikuphatikizapo kumanga kaye chipinda choyeretsedwa, kenaka chigwiritseni ntchito mosinthasintha momwe msika ukufunikira.

Choi Si-young, pulezidenti wa Samsung Electronics ' foundry business unit, anati, "Tikugwira ntchito mafakitale asanu ku Korea ndi United States, ndipo tapeza malo omanga mafakitale oposa 10."

IT House yaphunzira kuti Samsung Electronics ikukonzekera kukhazikitsa m'badwo wachiwiri wa 3-nanometer mu 2023, kuyamba kupanga 2-nanometer mu 2025, ndikuyambitsa njira ya 1.4-nanometer mu 2027, njira yaukadaulo yomwe Samsung idaulula koyamba ku San. Francisco pa Oct. 3 (nthawi yakomweko).